Process Capability

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Process Capability

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• SMT production line: 3

• DIP production line: 2

• Assembly and packaging line: 1

• Daily patch processing capacity: 1.5 million pieces

• Corresponding PCB size: 50x50--356x457mm

• Corresponding smallest device: 0402

• Corresponding to welding and maintenance of QFP, BGA and other devices

• Auxiliary equipment:

Solder paste tester, AOI, ICT, X-RAY, BGA rework station, automatic board separator, etc.

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