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Process Capability

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Process Capability
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• SMT production line: 3
• DIP production line: 2
• Assembly and packaging line: 1
• Daily patch processing capacity: 1.5 million pieces
• Corresponding PCB size: 50x50--356x457mm
• Corresponding smallest device: 0402
• Corresponding to welding and maintenance of QFP, BGA and other devices
•  Auxiliary equipment:
    Solder paste tester, AOI, ICT, X-RAY, BGA rework station, automatic board separator, etc.
 
 
 
 
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